Embedded Die Packaging Technology Market Size, Share, Industry Trends and Forecast to 2030

1. What is the Market Size & CAGR of Embedded Die Packaging Technology market in 2021?

The global embedded die packaging technology market is anticipated to witness a significant growth rate of 5.8% CAGR from 2021 to 2026. The market size is expected to reach USD 2.3 billion by the end of 2026.

2. COVID-19 Impact on the Embedded Die Packaging Technology Market

The COVID-19 pandemic has had a mixed impact on the embedded die packaging technology market. On one hand, the disruptions in the global supply chain and manufacturing processes have resulted in delays in product launches and reduced demand from end-users. On the other hand, the increased focus on digital transformation and the adoption of advanced technologies have created new opportunities for growth in the market.

3. Embedded Die Packaging Technology Dynamics

The embedded die packaging technology market is driven by the increasing demand for compact and high-performance electronic devices across various industries such as consumer electronics, automotive, and healthcare. The growing trend of miniaturization in electronics, coupled with the need for higher reliability and improved thermal management, is driving the adoption of embedded die packaging technology.

Additionally, the advancements in semiconductor packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP), are further boosting the growth of the embedded die packaging technology market. These technologies enable the integration of multiple functions into a single package, leading to a reduction in the overall size of electronic devices.

4. Segments and Related Analysis

4.1 Embedded Die Packaging Technology Market by Type

- Fan-Out Wafer-Level Packaging (FOWLP)

- System-in-Package (SiP)

- Embedded Multi-Die Interconnect Bridge (EMIB)

- Others

4.2 Embedded Die Packaging Technology Market by Application

- Consumer Electronics

- Automotive

- Healthcare

- Aerospace and Defense

- Others

5. By Region Analysis

5.1 North America

The North America region is expected to hold a significant market share in the embedded die packaging technology market due to the presence of key players and the high adoption of advanced technologies in countries like the United States and Canada.

5.2 Europe

Europe is projected to witness substantial growth in the embedded die packaging technology market, driven by the increasing demand for miniaturized electronic devices in industries such as automotive and healthcare.

5.3 Asia Pacific

Asia Pacific is expected to emerge as a lucrative market for embedded die packaging technology, supported by the rapid industrialization, technological advancements, and the presence of major semiconductor manufacturers in countries like China, Japan, and South Korea.

5.4 Latin America

Latin America is likely to witness steady growth in the embedded die packaging technology market, fueled by the increasing investments in the electronics industry and the growing adoption of advanced packaging solutions in countries like Brazil and Mexico.

5.5 Middle East and Africa

The Middle East and Africa region are expected to experience moderate growth in the embedded die packaging technology market, supported by the rising demand for high-performance electronic components in sectors such as telecommunications and industrial automation.

6. Key Market Players and Competitive Landscape

- Intel Corporation

- Advanced Semiconductor Engineering, Inc.

- Taiwan Semiconductor Manufacturing Company Limited

- Samsung Electronics Co., Ltd.

- Amkor Technology, Inc.

- Qualcomm Technologies, Inc.

- Xilinx, Inc.

- Texas Instruments Incorporated

7. Recent happenings in the Embedded Die Packaging Technology Market

- In June 2021, Intel Corporation announced the launch of its new embedded multi-die interconnect bridge (EMIB) technology, enabling advanced packaging solutions for high-performance computing applications.

- In August 2021, Taiwan Semiconductor Manufacturing Company Limited introduced its latest system-in-package (SiP) technology, offering improved thermal performance and reliability for mobile and IoT devices.

- In October 2021, Samsung Electronics Co., Ltd. unveiled its new fan-out wafer-level packaging (FOWLP) technology, enabling higher levels of integration and cost-effective solutions for next-generation devices.

- In December 2021, Texas Instruments Incorporated announced its collaboration with Amkor Technology, Inc. to develop innovative embedded die packaging solutions for automotive and industrial applications.